QUOTE-ONLY SERVICE - PRICE FROM $995.00

ONLINE PROMO PRICE - $795 (BASED ON 20-30 SOLDER-BALLS)

Professional BGA and FBGA Reballing Services in Australia

Euro Car Electronics provides professional BGA reballing, FBGA reballing, processor rework and lead-free to leaded solder conversion from our electronics engineering facility on the Sunshine Coast, Queensland.

All reballing work is completed in-house by our electronics engineering team. We accept components from customers, electronics manufacturers, PCB assembly businesses, automotive repair specialists, engineering companies and organisations working with industrial, defence, aerospace, medical and other high-reliability electronics.

Components can be sent to us from anywhere in Australia. We can process individual components, prototype quantities, qualification batches and repeat commercial batches.

Lead-Free to Leaded BGA Solder Conversion

Many modern BGA and FBGA components are supplied only with lead-free solder balls. Some legacy assemblies, controlled manufacturing processes and specialist applications require the component to be converted to a specified leaded solder alloy before installation.

Our reballing process removes the original solder spheres, prepares the component pads and applies new solder spheres using a package-specific stencil and controlled thermal profile.

We maintain commonly required leaded solder-ball sizes in stock and can review alternative ball diameters or solder alloys where a particular customer or engineering specification applies.

Please provide the required alloy specification when requesting a quotation. Where no specification has been nominated, we will discuss the available options before processing the components.

Our In-House BGA Rework Capability

• BGA and FBGA component reballing
• Lead-free to leaded solder conversion
• Replacement of damaged, oxidised or inconsistent solder balls
• Reballing of new or recovered components
• Loose component reballing
• Removal of components from populated PCBs
• Cleaning and preparation of component and PCB pads
• Reballing and refitting of components to circuit boards
• Prototype, qualification and commercial batch processing
• ESD-controlled handling
• Documented temperature profiles
• Incoming and outgoing photographic records
• Component and batch traceability
• Technician process records and sign-off where requested

Professional PPR BGA Rework Equipment

Our workshop uses a professional British-manufactured PPR BGA rework station designed for controlled removal, positioning and reflow of surface-mounted components.

The system incorporates precision camera alignment to accurately position the processor or component during removal and installation. Controlled thermal profiles allow the heating process to be adapted to the component, PCB construction, solder alloy and customer requirements.

Our electronics engineer can also perform specialised manual stencil reballing where the component design or project requirements make this the preferred process.

Our BGA Reballing Process

1. Technical review

Before accepting the work, we review the manufacturer, complete component part number, package dimensions, ball pitch, ball count, solder-ball diameter, existing alloy, required replacement alloy and intended quantity.

2. Incoming inspection and identification

The components are inspected and recorded on arrival. Photographs, batch identification and individual traceability can be provided where required.

3. Removal of the existing solder balls

The original solder spheres and residual solder are carefully removed. The component pads are then cleaned and inspected for pad damage, contamination, oxidation or evidence of previous rework.

4. Stencil and solder-ball preparation

A suitable stencil is selected or sourced for the component package. The required solder spheres are positioned according to the component layout, pitch and ball-map configuration.

5. Controlled reflow

The solder balls are reflowed using an appropriate controlled temperature profile. The process is selected according to the component construction, solder alloy and applicable technical requirements.

6. Cleaning and microscope inspection

After reflow, the component is cleaned and inspected under magnification. Solder-ball formation, alignment, consistency and visible surface condition are checked before the component is released.

7. PCB installation where required

Where the service includes removal and refitting, the component is accurately aligned and installed onto the customer’s PCB using the PPR rework station. The board is then cleaned and visually inspected.

Loose Components and Populated Circuit Boards Accepted

We can accept:

• New loose components purchased from an authorised distributor
• Recovered or previously installed components
• Components supplied in trays or suitable ESD packaging
• Complete populated circuit boards requiring component removal
• Boards requiring removal, reballing and refitting of the original component
• Boards requiring installation of a replacement BGA or FBGA component

Please advise whether the work involves reballing only or a complete remove, reball and refit service.

Industries and Applications We Support

Our BGA and processor rework capabilities may be suitable for:

• Automotive electronic control modules
• Industrial control equipment
• PCB manufacturing and assembly
• Prototype and product-development projects
• Legacy electronic assemblies
• Embedded computing and communication equipment
• Defence and aerospace-related projects
• Medical and laboratory equipment
• Low-volume specialist manufacturing
• Obsolete or difficult-to-source electronic components

Customer-specific quality, regulatory, security and acceptance requirements must be supplied before quotation and processing.

BGA Reballing Turnaround Options

We offer three service priorities, subject to technical review, stencil availability and batch size:

• Silver Priority: approximately 1–2 weeks
• Gold Priority: approximately 1–2 business days
• Platinum Priority: approximately 24 hours

As an initial guide, our current Platinum capacity is approximately 10–20 stencil-reballed components per working day. Actual capacity depends on the number of solder spheres, package complexity, component condition, thermal requirements and inspection process.

Urgent turnaround must be confirmed before components are dispatched.

Prototype, Qualification and Commercial Batch Reballing

For new component types or controlled commercial applications, we can begin with a small qualification batch. This allows the customer to review the finished components, process documentation and acceptance standard before authorising a larger batch.

Preferential commercial pricing may be available for:

• Multiple identical components
• Batches of 10, 20, 50 or more units
• Repeat production requirements
• Regular engineering or PCB assembly customers
• Forward-planned work using an existing stencil and established profile

Final pricing depends on the package, ball count, ball diameter, stencil requirements, incoming condition, quantity, required documentation and turnaround priority.

Quality Records and Traceability

Depending on the project requirements, we can provide:

• Incoming component identification
• Batch and quantity records
• Incoming and outgoing photographs
• Recorded reflow temperature profiles
• Solder-ball alloy and diameter records
• Technician identification and sign-off
• Component serial or customer reference tracking
• Secure handling and customer-specific documentation

We are comfortable reviewing non-disclosure agreements, controlled-distribution requirements, export restrictions and customer-specific chain-of-custody procedures before commencing work.

Inspection Limitations

Standard processing includes visual and microscope inspection. In-house X-ray inspection is not currently included.

If X-ray verification or another specialised acceptance test is mandatory, please advise us before requesting a quotation so the inspection requirements and available options can be reviewed.

Information Required for a BGA Reballing Quote

To assess the component and prepare an accurate quotation, please send:

• Component manufacturer
• Complete manufacturer part number, including all suffixes
• Manufacturer datasheet
• Clear photographs of the top and underside
• Package type and physical dimensions
• Ball pitch and total populated ball count
• Required solder-ball diameter
• Current solder alloy, where known
• Required replacement solder alloy
• Moisture-sensitivity level and baking requirements
• Whether the parts are new, recovered or previously reworked
• Whether the parts are loose or installed on PCBs
• Quantity required
• Expected ongoing or annual quantity
• Required turnaround priority
• Required inspection and acceptance criteria
• Documentation, security and traceability requirements

Do not order the service until we have reviewed the component details and confirmed technical feasibility, pricing and turnaround.

Australia-Wide Mail-In BGA Reballing Service

Components and circuit boards can be securely shipped to our electronics engineering workshop from anywhere in Australia.

Please use suitable ESD packaging, protect all component pins and PCB connectors, and place the items inside a rigid box with sufficient cushioning. Retain the tracking details for your shipment.

Workshop address:
Euro Car Electronics Pty Ltd
45 Wises Road
Buderim QLD 4556
Australia

Frequently Asked Questions

Can you convert a lead-free BGA component to leaded solder?

Yes. Lead-free to leaded solder conversion is one of our principal BGA reballing services. We require the complete component details, required alloy, ball diameter and customer acceptance requirements before confirming the work.

Can you reball loose processors?

Yes. We accept new and recovered loose BGA and FBGA components, provided they are supplied in suitable ESD-safe packaging.

Can you remove and reinstall the component on the PCB?

Yes. We can assess complete circuit boards for component removal, pad preparation, reballing, alignment and refitting.

Do you keep leaded solder balls in stock?

We maintain commonly used leaded solder-ball sizes in stock. Please provide the exact alloy and diameter required so availability can be confirmed.

Can you process commercial quantities?

Yes. We can process individual components, qualification samples and repeat batches. Capacity and pricing depend on the component package, ball count, tooling and required turnaround.

How quickly can BGA components be reballed?

Silver, Gold and Platinum priority services are available. Urgent processing can be completed in approximately 24 hours for suitable quantities and component types, but it must be arranged before dispatch.

Do you provide X-ray inspection?

Standard service includes microscope inspection but does not currently include in-house X-ray inspection. Please identify any mandatory X-ray or specialist testing requirement before quotation.

Do you provide a warranty?

Warranty coverage applies to the workmanship performed by us and is subject to the agreed scope, component condition and terms of service. We cannot warrant the internal functionality, previous condition or remaining service life of customer-supplied components unless specifically agreed in writing.

Request a BGA Reballing Assessment

Send us the complete component details and required quantity before placing an order. Our electronics engineering team will review the application and confirm feasibility, required tooling, turnaround and pricing.

Contact Euro Car Electronics about your BGA reballing project or call 07 5479 5555.