Euro Car Electronics provides BGA and FBGA component reballing, processor rework and lead-free to leaded solder conversion at our electronics engineering workshop on the Sunshine Coast, Queensland. All reballing work is completed in-house, with an Australia-wide mail-in service for components and circuit boards.

We work with individual components, prototypes, qualification batches and repeat commercial quantities. Customers include electronics manufacturers, PCB assembly businesses, automotive repair specialists and engineering companies.

BGA solder-ball replacement and alloy conversion

Reballing removes the existing solder balls from beneath a BGA or FBGA component and replaces them with new solder spheres matched to the package and application. It can be used to replace damaged, oxidised or inconsistent solder balls, prepare recovered components for reuse, or change the solder alloy before installation.

Lead-free to leaded solder conversion is available for legacy assemblies and applications requiring a specified leaded alloy. We maintain commonly required leaded solder-ball sizes in stock and can review other diameters and alloys against your requirements.

Loose components and populated circuit boards

Our service can include:

• Reballing new or recovered loose BGA and FBGA components
• Removing components from populated circuit boards
• Cleaning and preparing component and PCB pads
• Reballing and refitting the original component
• Installing a replacement BGA or FBGA component
• Processing prototype, qualification and repeat commercial batches

Tell us whether you require reballing only, component replacement, or a complete removal, reballing and refitting service so the quote covers the work you need.

Professional PPR rework equipment

Our workshop uses a British-manufactured PPR BGA rework station for controlled component removal, positioning and reflow. Camera alignment supports accurate placement, while controlled thermal profiles allow the heating process to suit the component, PCB construction and solder alloy.

Specialist manual stencil reballing is also available where the package design or project requirements call for it.

Our BGA reballing process

1. Technical review: We review the component identification, package specifications, solder requirements, quantity and requested work.
2. Incoming inspection: Components are identified and inspected on arrival, with photographs and batch records where required.
3. Solder removal and pad preparation: Existing solder balls and residual solder are removed. The pads are cleaned and inspected for damage, contamination, oxidation and signs of previous rework.
4. Stencil and solder-ball preparation: A suitable stencil is selected or sourced, and the specified solder balls are positioned to match the component layout and pitch.
5. Controlled reflow: The solder balls are reflowed using a temperature profile appropriate to the component construction and alloy.
6. Cleaning and microscope inspection: Residual flux is cleaned away, and solder-ball formation, alignment, consistency and visible condition are inspected.
7. PCB refitting where included: The component is aligned and installed onto the board, followed by cleaning and visual inspection.

Batch processing, records and traceability

For new component types or commercial projects, we can begin with a small qualification batch so you can review the results and agreed documentation before proceeding with a larger quantity.

ESD-controlled handling forms part of our rework capability. Project-specific records can include:

• Incoming component identification and batch quantities
• Incoming and outgoing photographs
• Recorded reflow temperature profiles
• Solder-ball alloy and diameter records
• Technician identification and sign-off
• Component serial numbers or customer reference tracking

We accept enquiries for automotive, industrial, embedded electronics, PCB manufacturing, defence, aerospace, medical and laboratory applications. Include any specific inspection, documentation, confidentiality or handling requirements in your enquiry so these can be reviewed as part of the job.

Pricing and requesting a quote

Pricing starts at AUD $995. Your quote takes account of the component package, ball count and diameter, stencil requirements, incoming condition, quantity, required operations and inspection or documentation needs. Include any repeat or ongoing quantities so we can assess batch pricing.

Select Request a Quote and provide:

• The component manufacturer and complete part number, including suffixes
• The quantity and whether the components are new, recovered or previously reworked
• Whether the components are loose or installed on circuit boards
• The work required, relevant fault symptoms and any deadline
• Any required solder alloy, inspection standard or documentation

If available, also include the datasheet, clear photographs, package dimensions, ball pitch, ball count, solder-ball diameter and any moisture-sensitivity or baking requirements. These details help us assess the tooling and process needed.

We’ll review your request and advise the price, expected turnaround and delivery arrangements.

Australia-wide mail-in service

Components and circuit boards can be sent to our Buderim workshop once the service arrangements have been confirmed. Use suitable ESD packaging and a rigid, cushioned box that protects the components, circuit board and connectors during transport.

Workshop address:
Euro Car Electronics Pty Ltd
45 Wises Road
Buderim QLD 4556
Australia

Request a quote for BGA or FBGA reballing

Frequently asked questions