Diagnostics of Electronic component with Euro Car Electronics engineering team
ECE's Electronic Diagnostics includes the following steps:
Disassembly: The module or component is carefully taken apart to gain access to its internal components.
Visual Inspection: A thorough examination is conducted to identify any signs of corrosion, damage to components, or water damage.
Microscopic Inspection: Using a microscope, a detailed inspection is performed to detect any dry solder joints or damage to pass-throughs.
SMD Component Measurement: SMD (Surface Mount Device) components are measured using an oscilloscope and a multi-meter to ensure correct resistance and current.
Repairing Micro Dry Solder Joints: Any micro dry solder joints are fixed, and the PCB (Printed Circuit Board) is cleaned using Isopropyl alcohol.
Reassembly and Sealing: The component or module is carefully put back together, ensuring proper alignment, and then sealed to protect it from external elements.
Reporting and Recommendations: A comprehensive report is written, detailing the findings of the diagnostics process and listing the specific items that require repair. This report is provided to the client for their reference and decision-making.
These steps are aimed at thoroughly assessing the electronic equipment, identifying any issues or faults, and providing the client with accurate information to make informed decisions regarding repairs.
What's included in ECE's Electronic Diagnostics:
- 1. Disassemble the module / component.
- 2. Visual Inspection for corrosion / damaged components and water damage.
- 3. Inspection under microscope looking for dry solder joints & pass through's damage.
- 4. SMD Component measurement for correct resistance & current with Oscilloscope & Multi-meter.
- 5. Fix micro dry solder joints & clean the PCB with Isopropyl alcohol.
- 6. Re-assemble the component / module and seal.
- 7. Write a report & provide findings / items to repair to the client.